ASPEED信骅科技为一家卓越的Fabless无晶圆厂IC设计公司，2004年成立于台湾新竹科学园区。ASPEED信骅科技为市场顶尖SoC系统解决方案的领导者与创始者，专注于高毛利之利基型市场，并致力于研发创新与差异化之产品。ASPEED信骅科技为市场顶尖SoC系统解决方案的领导者与创始者，其研发领域涵盖：远程服务器管理芯片(Baseboard Management Controller SoC)、PC /AV影音延伸芯片(PC/AV Extension SoC)、及最新的Cupola360 影像拼接专用处理芯片(Cupola360 Image Stitching SoC)。

ASPEED信骅科技致力于研发自主创新技术、快速反应客户需求，是创新SoC系统解决方案的提供者及可信赖的合作伙伴，目前为全球第一大远程服务器管理芯片供货商，于2014年，2015年2018年以及2019年分别荣获富比士杂志(Forbes)评选为亚太地区200大最佳中小企业 (Asia's 200 Best Under a Billion)，2016年宣布并购博通旗下Emulex Pilot™服务器远程管理芯片事业，并于2018年正式推出Cupola360 360度影像拼接处理芯片暨解决方案，将产品线扩及图像处理相关领域。目前ASPEED信骅科技公司员工约为80人，营运据点主要以台湾及美国为主。

ASPEED信骅科技的愿景为致力于研发自主创新，快速反应客户需求，成为创新SoC系统解决方案的领导者；而经营理念则透过人性化管理，尊重员工自主性，透过创新研发及团队合作，满足客户需求，并且坚持给予最高质量、服务及技术，成为客户可信赖的长期合作伙伴。

ASPEED Technology Inc. is a highly innovative fabless IC-design company founded in 2004 and headquartered in Hsinchu, Taiwan. As a pioneer of cutting-edge SoC solutions with a focus on the niche market of high-margin products, the company's specialties range from Remote Server Management SoC solution, PC/AV extension solution, to the latest Cupola360 360-degree image processing SoC. ASPEED has been dedicated to developing innovative technologies in order to quickly respond to customer needs, which has made the company a leading provider of innovative SoC system solutions as well as a reliable business partner.

ASPEED is currently the world's No. 1 BMC (Baseboard Management Controller) chipset provider, and has been honored as one of "Forbes Asia's 200 Best Under a Billion" companies in 2014, 2015, 2018, and 2019. In 2016, ASPEED acquired Broadcom's Emulex Pilot™ remote server management chip business. In 2017, ASPEED announced the Cupola360 – an image processor specifically designed for multiple images stitching technology, as well as the accompanying mobile apps.